(Food-Beverage-News.Com, September 06, 2017 ) Organic substrates are the base layers of individual semiconductor devices and ICs on which other layers are deposited to complete a circuit. As these materials are part of the circuit, it is imperative that they are efficient conductors of electricity, and preferably thinner core materials are used to surround them in demanding system applications. A small die (block of semiconducting material made of silicon or gallium arsenide with a fabricated circuit) is mounted on the substrate, which connects the input and output terminals from the die to a PCB.
Organic substrates are surrounded by low-loss and ultra-thin materials that have a dielectric base. A thin film layer used to protect the semiconductors on the substrate is made of polyamide and polyester films. These materials are mainly used in area array packages such as BGA and PGA.
Publisher's analysts forecast the global organic substrate packaging materials market to grow at a CAGR of 5.41% over the period 2014-2019.
Covered in this report This report covers the present scenario and the growth prospects of the global organic substrate packaging materials market for the period 2015-2019. The report provides the vendor landscape and a corresponding detailed analysis of the top six vendors in the market. The market segmentation is done based on the following: - Packaging technology - Geography
Publisher's report, Global Organic Substrate Packaging Materials Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts.
Key regions - APAC - Europe - North America - ROW
Key vendors - AJINOMOTO - AMKOR - ASE Kaohsiung - Mitsubishi Gas Chemical - SPIL - STATS ChipPAC
